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Electronic Packaging Material - Potting and Encapsulating Gels


Details: EPM-2481 - Tough Firm Gel


Product Profile: EPM-2481P.pdf
MSDS PDF A: EPM2481A.pdf
MSDS PDF B: EPM2481B.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Gels
NuSil ID: EPM-2481
Flow/Viscosity: A:15,000 / B:9,000
Cure System: Platinum Addition
Work Time: 1 D
Cure Time/Temp: 30 m / 150
Durometer Type A Typical: Very Firm
Ionic Content* CI - K / Na ppm <5 / <1 / <2
Volume Resistivity** ohm·cm 1 x 10<sup>14</sup>
Operating Temp: -65 to 250
Mix Ratio: 1:1
Colour: Trans
Comments: Tough Firm Gel

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!

 



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